PCB Assembly Mistakes Designers Keep Making: PCB West 2026 Preview
Summary
Host Zach Peterson interviews Mike Buto, Chris Shea, and Daniel Stanhill about the expanded circuit assembly track at PCB West. The guests preview technical sessions on paste printing, placement, and super high-density assembly, while discussing the critical need for designers to understand downstream manufacturing constraints. They address common misconceptions, such as relying on unvalidated internet footprints, and emphasize the importance of networking to build professional relationships and navigate the evolving industry landscape.
Topics discussed
Designer misconceptions about assembly relationships
Introduction to PCB West and guests
Guest introductions: Mike Buto, Daniel Stanhill, Chris Shea
Overview of the PCB West event structure
Expansion of assembly sessions and mentoring next gen
Value of manufacturing knowledge for designers
Preview of technical sessions: basics and advanced
AI impact and appreciation for circuit board complexity
Super high density assembly and UHDI test vehicles
Key takeaways: networking and understanding assembly
Challenges of complex assemblies and coplanarity
Practical knowledge and the importance of networking
Defense industry scale-up and talent development
Staffing challenges and conference networking benefits
Misconceptions: designer vs assembler dynamics
Design intent, cost, and footprint validation issues
Reliability of datasheets and the need for DFM
Recommended sessions: X-ray, stencils, and solder paste
The science of stencil design and manufacturing
Solder paste types and properties for assembly
Event highlights: trade show, keynotes, and training
Closing remarks and call to action
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